Materials

Materials

Substrate: Silicon Wafer (SOI, Prime, Test), InP Wafer

Etch: Metal Parts Knurling & Plasma Coating, Ceramic Parts, Quartz Parts

CMP: PVA Brush, Retaining Ring, Slurry, Post-CMP Cleaner

Thin Film: Sputtering Targets & Slugs, SOG, MOCVD Source, Cold Trap Filter, Ceramic Parts

Photolithography/Clean Tech: Photoresist, Stripper

Backend: Grinding wheel and dicing blades

Solar: Transport Roller, SiC Heater, Copper Antenna, Transfer Cassette

Others: Customized blends for scrubber

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